China 1200degrees Glass Quartz for Searchlight

The company introduces advanced laser equipment, ultrasonic instruments, engraving and grinding machines and other advanced equipment, and has experienced technicians who can provide customers with high-precision glass wafers with thickness ≥0.1mm and external dimensions ≥Φ2" Glass wafer), used in CMOS, CCD sensors, integrated circuits or micro-mechanical component packaging (MEMS), communications and data processing, optics, electronics, home appliances, military, scientific research and other high-tech products.

l Product features:
a)Application-specific use of glass material
b)Vast expertise in the area of polishing and unique surface qualities
c)Clean room compatible packaging of ready-to-use substrates
d)Structured wafers with excellent tolerances
e)Customer-specific products that meet all requirements and industry standards (e.g. SEMI)
f)Integrated production processes that meet ISO 9001:2000 requirements and standards

l Typical application:
Micro-optics
MEMS (pressure sensor, accelerometer...)
Wafer level packaging (image sensor package...)
Bioengineering (microfluidics, DNA analysis...)
PLC wafer cover
And many other customer-specific applications.

Technical parameter:
a) Material: BOROFLOAT®33, PYREX7740, quartz glass, Corning Eagle-XG, B270, D262T, AF32,Soda lime
b) Standard thickness: 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm (thickness tolerance ± 0.02mm)
c) Standard size: Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)
d) Appearance: 60/40
e) Surface roughness (Ra) <1.5nm
f) Parallelism <0.01mm
g) Each edge is blunt C0.05~0.2mm
h) Crack <0.2mm, not crackable
i) The surface is clean and must not be imprinted or stained. It is packaged under a clean workbench and packaged in a special box.

Technical parameters: Density(25ºC)2.2g/cm2
Thermal expansion(ISO 7991)3.25´10-6k-1Light transmittance91%Softening point820ºCShort time use<10h550ºCLong time use>=10h450ºCRefractive index
(587.6nm)1.47140Knoop hardness480

Coefficient of Linear Thermal Expansionα (20 - 300 °C)3.25 x 10-6 K-1(ISO 7991)RemarksSpecific Thermal
CapacityCp (20 - 100°C)0.83 KJ x (kg x K)-1The maximum temperatures in use indicated apply only if the following RTG and RTS values are observed at the same time.
Specific Thermal
Conductivityλ (90°C)1.2 W x (m x K)-1For short-term usageδ max (< 10 h)550°CFor long-term usageδmax (≥ 10 h)450°C

Viscosity of Borosilicate Glasses:

Working Point104 dPas1270 °CSoftening Point10 7.6 dPas820 °CAnnealing Point10 13 dPas560 °CStrain Point10 14.5 dPas518 °CTransformation Temperature (Tg) 525 °C

Selected Standard Lasers and Related Wavelengths:

Wavelength
(nm)Laser
MediumWavelength
(nm)Laser
MediumWavelength
(nm)Laser
Medium308XeCI488Ar1047Nd:YLF325HeCd514.5Ar1053Nd:YLF337N2532Nd:YAG1064Nd:YAG350xeF632.8HeNe1153HeNe351.1Ar694.3Ruby1319Nd:YAG363.8Ar730-780Alexandrite1730Er:YLF427N2850Er:YLF2060Ho:YLF441.6HeCd905GaAs10640CO2

Wavelength λ(nm)435.8479.9546.1Index of Refraction n1.480151.476761.47311Wavelength λ(nm)589.3643.8656.3Index of Refraction n1.471331.469531.46916Abbe ConstantVe=(ne-1)/(nF'-nC')65.41 Refractive Indexnd(λ587.6 nm)1.47140 DispersionnF-nC71.4x10-4 Stress-optical
Coefficentin in Mpa-1K4.0x10-6mm2N-1MPa-1