Application of Plating System: Gold, nickel, tin, copper and silver plating, aluminum-oxidation, phosphatation, electrolytic polishing, chemical nickel-plating and other chemical treatments for processes such as gold plating of pin on electronic components, Ni-Au plating on electronic packaging, aluminum substrate chromating, anodizing etc.
Features: Highly efficient, energy saving, clean, safe and reliable.
Type of Production Lines:
Control System: Manual, semi-automatic, or fully automatic;
Plating Rack: Barrel plating or rack plating
Traveling Crane: Sidearm or gantry crane.
Manual Plating System
Barrel Plating System for Electronic Components
Rinsing and Plating Table for Semiconductors
Roller Plating Unit