Application: The mass plating production of chip component and micro metal parts; Pretreatment, silver plating, nickel plating and tin plating of chip components.
Project experiences: Electroplating production line for SMD and connectors etc.
Feature: The roller is optimal designed of technology according customers requirements. Having reliable system, high efficiency, bright fine and uniform appearance. The line takes man-machine interface touch-screen control management. It can effectively montior the data, pH, time and running conditions etc, and is easy to adjust process parameter according to different process feature.
Technical Specification: Cantilevered crane, gantry crane, the running rate of crane 0~25mmin, lifting rate of crane 0~12m/min, the lifting weifght 50~200Kg.
Option: Special roller, solution online testing and automatic feeding, roller with speed regulator, computer control system, and rectifier automatic control.