Printed Circuit Board, FPC Certification, FPC Connector manufacturer / supplier in China, offering Membrane Switch Factory Flexible PCB Assembly in Double-Sided PCB Printed Circuit Board, Membrane Keypad 4X4 + Extras Design Guide, Membrane Switch Keypad with FPC and so on.
Min. Order / Reference FOB Price | |
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5 Pieces | US $0.89/ Pieces |
Local Area: | Shenzhen, Guangdong, China |
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R&D Capacity: | OEM, ODM, Other |
Payment Terms: | LC, T/T, PayPal |
Brand: | Yizexin |
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Type: | Flexible Circuit Board |
Dielectric: | FR-4 |
Material: | Fiberglass Epoxy |
CoverlayOpenings
0.2mmMinimumSpacebetweencoverlayandsolderpad
0.15mmPolyimideFilms0.5mil(12.5),1mil(25),2mils(50),3mils(75),4mils(100),5mils(125)ascustmerrequested
ThermobondAdhesivesAcrylic/ModifiedAcrylic,ModifiedEpoxy,PolyimideCopperFoils(RAorED)1/3oz(12),1/2oz(18),1oz(35),2oz(70)SurfaceFinishElectrolessNi/Au,Electrolyticsoft/hardgold,Tinplating,,Imm.Tin,Entek/OSP
SolderResistsCoverlay,Photo-ImagableResistCopperPlatedThickness(PTHonly)8~15um;20~30um;30~70um(special)Minimumspacebetweencoverlayandconductor
±0.15mmMinimumconductoredgetooutlineedge
≥0.1mmAuthicknessElectroless Ni/Au Ni:2~6um;Au:0.035~0.075um
Electrolyticsoft/hardgoldNi:2~9um;Au:0.035~0.1um
SmallestDrillSize0.2mmLargestDrillSize6.3A blend of rigid and flex emphasizing the best of both constructions, adding complimenting capabilities that neither possess alone. In its most typical configuration, the rigid-flex is as a series of rigid PCBs joined by integrated flex circuits (with emphasis on the high percentage of rigid area content). There are many excellent possibilities for circuits designed primarily as a flex circuit with the addition of integrated rigid areas. The rigid areas provide excellent hard mount points for components, connectors and chassis while flex areas offer dynamic flexing, flex to fit, and component mounting poised to take advantage of these low mass and vibration resistant zones. This blending leads to creative solutions for your most demanding applications.
Multilayer flex circuits offer exceptional performance and reliability in situations where the circuit is exposed to excessive vibration or shock combined with frequent bending or folding. Multilayer technology allows high circuit density connections to be achieved in applications where one or two layers of conductors could not meet the required circuit packaging requirements. Additionally, multilayer flex circuits provide increased functionality with a smaller footprint.